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Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 6 |
| Part Status | Obsolete |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual |
| Package Width | 1.35(Max) |
| Package Height | 1(Max) |
| Package Length | 2.2(Max) |
| Supplier Package | TSSOP |
| Maximum IDSS (uA) | 0.024 |
| Standard Package Name | SOP |
| Typical Power Gain (dB) | 34 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 180 |
| Maximum Drain Source Voltage (V) | 6 |
| Maximum Gate Threshold Voltage (V) | 1 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Drain Current (A) | 0.03 |
| Typical Forward Transconductance (S) | 0.027 |
| Typical Input Capacitance @ Vds (pF) | 2.4@5V@Gate 2|2.5@5V@Gate 1 |
| Typical Output Capacitance @ Vds (pF) | 0.8 |
| Maximum Gate Source Leakage Current (nA) | 20@Gate 2|50@Gate 1 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 0.025 |
| Description |
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Beam Electronics is a one-stop platform for electronic components from overseas sites under the "BEAM TECHNOLOGY COMPANY LIMITED" (supporting online ordering and trading). Beam Electronics is committed to building an efficient overseas intelligent IC components trading platform, the main business scope of overseas regions! With the wisdom of data-driven services, the company aims to improve procurement efficiency for the midstream and downstream enterprises in the IC industry, and is determined to become a reliable one-stop procurement platform for overseas IC supply chain.
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