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Specification
| Product Attribute | Attribute Value |
| HTS | 8542.33.00.01 |
| PPAP | No |
| Type | Precision Amplifier |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 8 |
| Part Status | Active |
| Package Width | 4(Max) |
| Package Height | 1.5(Max) |
| Package Length | 5(Max) |
| Supplier Package | SOIC N |
| Manufacturer Type | Precision Amplifier |
| Minimum CMRR (dB) | 120 |
| Minimum PSRR (dB) | 120 |
| Power Supply Type | Dual |
| Shut Down Support | No |
| Standard Package Name | SOP |
| Minimum CMRR Range (dB) | >=115 |
| Typical Slew Rate (V/us) | 0.7@±5V |
| Typical Voltage Gain (dB) | 126.02 |
| Maximum Supply Current (mA) | 0.5@±5V |
| Number of Channels per Chip | 1 |
| Typical Output Current (mA) | 10@±5V |
| Maximum Dual Supply Voltage (V) | ±15 |
| Maximum Input Bias Current (uA) | 0.002@±5V@-40C to 125C |
| Minimum Dual Supply Voltage (V) | ±2.5 |
| Typical Dual Supply Voltage (V) | ±3|±5|±9|±12 |
| Maximum Input Offset Current (uA) | 0.001@±5V@-40C to 125C |
| Maximum Input Offset Voltage (mV) | 0.06@±5V |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Typical Gain Bandwidth Product (MHz) | 1.3 |
| Typical Input Noise Voltage Density (nV/rtHz) | 7.9@±5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.2@±5V |
| Description |
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Beam Electronics is a one-stop platform for electronic components from overseas sites under the "BEAM TECHNOLOGY COMPANY LIMITED" (supporting online ordering and trading). Beam Electronics is committed to building an efficient overseas intelligent IC components trading platform, the main business scope of overseas regions! With the wisdom of data-driven services, the company aims to improve procurement efficiency for the midstream and downstream enterprises in the IC industry, and is determined to become a reliable one-stop procurement platform for overseas IC supply chain.
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