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SISH106DN-T1-GE3
SISH106DN-T1-GE3
MOSFETs SISH106DN-T1-GE3
Vishay
SISH106DN-T1-GE3
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
AutomotiveNo
Lead ShapeNo Lead
PCB changed8
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Quad Drain Triple Source
Package Width3.3
Package Height0.93(Max)
Package Length3.3
Product CategoryPower MOSFET
Supplier PackagePowerPAK 1212-SWLH EP
Maximum IDSS (uA)1
Process TechnologyTrenchFET
Standard Package NamePowerPAK
Typical Fall Time (ns)12
Typical Rise Time (ns)15
Number of Elements per Chip1
Maximum Gate Resistance (Ohm)2.1
Minimum Gate Resistance (Ohm)0.7
Maximum Power Dissipation (mW)3800
Typical Gate Charge @ Vgs (nC)17.5@4.5V
Maximum Gate Source Voltage (V)±12
Typical Output Capacitance (pF)350
Typical Turn-On Delay Time (ns)25
Maximum Drain Source Voltage (V)20
Typical Gate Plateau Voltage (V)2.5
Typical Turn-Off Delay Time (ns)50
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.8
Typical Gate to Drain Charge (nC)2.8
Maximum Gate Threshold Voltage (V)1.5
Minimum Gate Threshold Voltage (V)0.6
Typical Gate Threshold Voltage (V)4.5|2.5
Typical Gate to Source Charge (nC)6.6
Typical Reverse Recovery Time (ns)30
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)12.5
Operating Junction Temperature (°C)-55 to 150
Maximum Drain Source Resistance (mOhm)6.2@4.5V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)12
Maximum Pulsed Drain Current @ TC=25°C (A)60
Maximum Power Dissipation on PCB @ TC=25°C (W)3.8
Maximum Continuous Drain Current on PCB @ TC=25°C (A)12.5
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)81
Description
SISH106DN-T1-GE3 Vishay MOSFETs Transistor N-CH 20V 12.5A 8-Pin PowerPAK 1212-SWLH EP T/R - Arrow.com
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