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ISL9N302AS3ST
ISL9N302AS3ST
MOSFETs ISL9N302AS3ST
onsemi
ISL9N302AS3ST
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
TabTab
PPAPNo
SVHCYes
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count3
AutomotiveNo
Lead ShapeGull-wing
PCB changed2
Part StatusObsolete
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
Package Width9.65(Max)
Package Height4.83(Max)
Package Length10.67(Max)
Product CategoryPower MOSFET
Supplier PackageTO-263AB
Maximum IDSS (uA)1
Process TechnologyTMOS
Standard Package NameTO-263
SVHC Exceeds ThresholdYes
Typical Fall Time (ns)34
Typical Rise Time (ns)120
Number of Elements per Chip1
Maximum Power Dissipation (mW)345000
Typical Gate Charge @ 10V (nC)200
Typical Gate Charge @ Vgs (nC)200@10V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)2000
Typical Turn-On Delay Time (ns)29
Maximum Drain Source Voltage (V)30
Typical Gate Plateau Voltage (V)2.3
Typical Turn-Off Delay Time (ns)45
Maximum Diode Forward Voltage (V)1.25
Typical Gate to Drain Charge (nC)31
Maximum Gate Threshold Voltage (V)3
Minimum Gate Threshold Voltage (V)1
Typical Gate to Source Charge (nC)25
Typical Reverse Recovery Time (ns)42(Max)
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)75
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)11000@15V
Typical Reverse Recovery Charge (nC)34(Max)
Maximum Drain Source Resistance (mOhm)2.3@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Typical Reverse Transfer Capacitance @ Vds (pF)900@15V
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)43
Description
Trans MOSFET N-CH 30V 75A 3-Pin(2+Tab) TO-263AB T/R
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