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Logic Output Photocouplers H11L3SR2VM
onsemi
H11L3SR2VM
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Optoelectronics
Logic Output Photocouplers
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Polarity | Inverting |
| Standard | UL|VDE |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Input Type | DC |
| Lead Shape | Gull-wing |
| Output Type | Open Collector |
| PCB changed | 6 |
| Part Status | Active |
| Package Width | 6.35 |
| Direction Type | Uni-Directional |
| Package Height | 3.4 |
| Package Length | 8.51 |
| Logic Gate Type | NAND Schmitt |
| Supplier Package | PDIP SMD |
| Maximum Data Rate | 1Mbps |
| Standard Package Name | DIP |
| Typical Fall Time (us) | 0.1 |
| Typical Rise Time (us) | 0.1 |
| Maximum Forward Voltage (V) | 1.5 |
| Maximum Reverse Voltage (V) | 6 |
| Number of Channels per Chip | 1 |
| Typical Forward Voltage (V) | 1.2 |
| Maximum Forward Current (mA) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Isolation Voltage (Vrms) | 4170 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Continuous Output Current (mA) | 50 |
| Description |
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