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IGBT Chip FGL60N100BNTDTU
onsemi
FGL60N100BNTDTU
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Diodes, Transistors and Thyristors
IGBT Chip
Specification
| Product Attribute | Attribute Value |
| Tab | Tab |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Through Hole |
| ECCN (US) | EAR99 |
| Packaging | Tube |
| Pin Count | 3 |
| Automotive | No |
| PCB changed | 3 |
| Part Status | LTB |
| Channel Type | N |
| Configuration | Single |
| Package Width | 5 |
| Package Height | 26 |
| Package Length | 20 |
| Supplier Package | TO-264 |
| Maximum Power Dissipation (mW) | 180000 |
| Maximum Gate Emitter Voltage (V) | ±25 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Collector-Emitter Voltage (V) | 1000 |
| Maximum Continuous Collector Current (A) | 60 |
| Maximum Gate Emitter Leakage Current (uA) | 0.5 |
| Typical Collector Emitter Saturation Voltage (V) | 2.5 |
| Description |
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