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Flash S29GL128S10FHB013
Infineon
S29GL128S10FHB013
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.51
PPAPYes
EU RoHSCompliant
MountingSurface Mount
Cell TypeNOR
ECCN (US)3A991.b.1.a
Page Size32byte
Pin Count64
AutomotiveYes
Boot BlockYes
ECC SupportYes
PCB changed64
Part StatusActive
Sector Size128Kbyte x 128
Timing TypeAsynchronous
ArchitectureSectored
Package Width11
Interface TypeParallel
Package Height0.6(Min)
Package Length13
Number of Words8M
ProgrammabilityYes
Supplier PackageFortified BGA
Block OrganizationSymmetrical
Chip Density (bit)128M
Command CompatibleYes
Process Technology65nm, MirrorBit
OE Access Time (ns)25
Program Current (mA)100
Support of Page ModeYes
Max. Access Time (ns)100
Location of Boot BlockBottom|Top
Maximum Erase Time (S)1.1/Sector
Operating Current (mA)60
Page Read Current (mA)25
Address Bus Width (bit)23
Programming Voltage (V)2.7 to 3.6
Number of Bits/Word (bit)16
Supplier Temperature GradeAutomotive
Maximum Page Access Time (ns)15
Maximum Programming Time (ms)269/Sector
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Description
NOR Flash Parallel 3V/3.3V 128M-bit 8M x 16 100ns Automotive 64-Pin Fortified BGA T/R
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