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NAND08GAH0JZC5E
NAND08GAH0JZC5E
Flash NAND08GAH0JZC5E
Micron Technology
NAND08GAH0JZC5E
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeManaged NAND
ECCN (US)3A991.b.1.a
Pin Count153
AutomotiveNo
Boot BlockYes
Lead ShapeBall
ECC SupportYes
PCB changed153
Part StatusUnconfirmed
Timing TypeSynchronous
ArchitectureSectored
Package Width11.5
Interface TypeSerial e-MMC
Package Height1
Package Length13
Number of Words8G/2G/1G
ProgrammabilityYes
Supplier PackageLFBGA
Chip Density (bit)8G
Command CompatibleYes
Program Current (mA)150
Support of Page ModeNo
Standard Package NameBGA
Operating Current (mA)80
Number of Bits/Word (bit)1/4/8
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3
Description
Managed NAND Flash Serial e-MMC 3.3V 8G-bit 8G/2G/1G x 1/4-bit/8-bit 153-Pin LFBGA
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