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N2M400FDB311A3CF
N2M400FDB311A3CF
Flash N2M400FDB311A3CF
Micron Technology
N2M400FDB311A3CF
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeManaged NAND
ECCN (US)3A991.b.1.a
PackagingTape and Reel
Pin Count100
AutomotiveNo
Boot BlockYes
Lead ShapeBall
ECC SupportYes
PCB changed100
Part StatusObsolete
Timing TypeSynchronous
ArchitectureSectored
Package Width14
Interface TypeSerial e-MMC
Package Height1.01
Package Length18
Number of Words32G/8G/4G
ProgrammabilityYes
Supplier PackageLBGA
Chip Density (bit)32G
Command CompatibleNo
Support of Page ModeNo
Standard Package NameBGA
Number of Bits/Word (bit)1/4/8
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3
Description
Managed NAND Flash Serial e-MMC 3.3V 32G-bit 32G/8G/4G x 1/4-bit/8-bit 100-Pin LBGA T/R
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