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MT46H64M32LFKQ-5 IT:C
MT46H64M32LFKQ-5 IT:C
DRAM Chip MT46H64M32LFKQ-5 IT:C
Micron Technology
MT46H64M32LFKQ-5 IT:C
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count168
AutomotiveNo
Lead ShapeBall
PCB changed168
Part StatusObsolete
Organization64Mx32
Package Width12
Interface TypeLVCMOS
Package Height0.65 - 0.24(Min)
Package Length12
Supplier PackageFBGA
Chip Density (bit)2G
Data Bus Width (bit)32
Standard Package NameBGA
Operating Current (mA)90
Address Bus Width (bit)14
Maximum Access Time (ns)6.5|5
Maximum Clock Rate (MHz)200
Number of Internal Banks4
Number of Words per Bank16M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip Mobile LPDDR SDRAM 2Gbit 64Mx32 1.8V 168-Pin FBGA Tray
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