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K4F6E3D4HB-MFCJ03V
K4F6E3D4HB-MFCJ03V
DRAM Chip K4F6E3D4HB-MFCJ03V
Samsung Electronics
K4F6E3D4HB-MFCJ03V
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR4 SDRAM
ECCN (US)EAR99
Pin Count200
AutomotiveUnknown
Lead ShapeBall
PCB changed200
Part StatusActive
Organization512Mx32
Supplier PackageFBGA
Chip Density (bit)16G
Data Bus Width (bit)32
Standard Package NameBGA
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)-40
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 512Mx32 1.8V Automotive 200-Pin FBGA
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