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K3UH7H70AM-AGCL
K3UH7H70AM-AGCL
DRAM Chip K3UH7H70AM-AGCL
Samsung Electronics
K3UH7H70AM-AGCL
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
MountingSurface Mount
DRAM TypeMobile LPDDR4X SDRAM
ECCN (US)EAR99
Pin Count556
AutomotiveNo
PCB changed556
Part StatusActive
Organization1Gx64
Supplier PackageFBGA
Chip Density (bit)64G
Data Bus Width (bit)64
Maximum Clock Rate (MHz)4266
Number of Bits/Word (bit)64
Number of I/O Lines (bit)64
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Typical Operating Supply Voltage (V)1.8|1.1|0.6
Description
DRAM Chip Mobile LPDDR4X SDRAM 64Gbit 1Gx64 0.6V/1.1V/1.8V 556-Pin FBGA
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