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K3QF2F200A-XGCE
K3QF2F200A-XGCE
DRAM Chip K3QF2F200A-XGCE
Samsung Electronics
K3QF2F200A-XGCE
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.39.00.01
PPAPNo
EU RoHSSupplier Unconfirmed
MountingSurface Mount
DRAM TypeMobile LPDDR3 DRAM
ECCN (US)EAR99
Pin Count253
AutomotiveNo
Lead ShapeBall
PCB changed253
Part StatusUnconfirmed
Organization512Mx32
Supplier PackageFBGA
Chip Density (bit)16G
Data Bus Width (bit)32
Standard Package NameBGA
Maximum Clock Rate (MHz)1066
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Typical Operating Supply Voltage (V)1.2
Description
DRAM Chip Mobile LPDDR3 DRAM 16Gbit 512Mx32 1.2V 253-Pin FBGA
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