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DRAM Chip EDB5432BEBH-1DAUT-F-D
Micron Technology
EDB5432BEBH-1DAUT-F-D
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Memory
DRAM Chip
Specification
| Product Attribute | Attribute Value |
| PPAP | Unknown |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| DRAM Type | Mobile LPDDR2 SDRAM |
| ECCN (US) | EAR99 |
| Packaging | Dry |
| Pin Count | 134 |
| Automotive | Unknown |
| Lead Shape | Ball |
| PCB changed | 134 |
| Part Status | Obsolete |
| Organization | 16Mx32 |
| Package Width | 10 |
| Interface Type | HSUL |
| Package Height | 0.58(Min) |
| Package Length | 11.5 |
| Supplier Package | VFBGA |
| Chip Density (bit) | 512M |
| Process Technology | CMOS |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Operating Current (mA) | 200 |
| Address Bus Width (bit) | 13 |
| Maximum Clock Rate (MHz) | 533 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Number of Bits/Word (bit) | 32 |
| Number of I/O Lines (bit) | 32 |
| Supplier Temperature Grade | Automotive |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.95|1.3 |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Description |
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