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SRAM Chip K7D803671B-HC33000
Samsung Electronics
K7D803671B-HC33000
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Memory
SRAM Chip
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Not Compliant |
| Mounting | Surface Mount |
| ECCN (US) | 3A991.b.2.a |
| Packaging | Tray |
| Pin Count | 153 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 153 |
| Part Status | Obsolete |
| Timing Type | Synchronous |
| Architecture | Pipelined |
| Package Width | 14 |
| Package Height | 1.61(Max) |
| Package Length | 22 |
| Number of Ports | 1 |
| Number of Words | 256K |
| Supplier Package | BGA |
| Chip Density (bit) | 9M |
| Process Technology | CMOS |
| Max. Access Time (ns) | 1.7 |
| Standard Package Name | BGA |
| Data Rate Architecture | DDR |
| Operating Current (mA) | 750 |
| Address Bus Width (bit) | 18 |
| Maximum Clock Rate (MHz) | 333 |
| Number of Bits/Word (bit) | 36 |
| Supplier Temperature Grade | Commercial |
| Maximum Operating Temperature (°C) | 70 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 2.63 |
| Minimum Operating Supply Voltage (V) | 2.37 |
| Typical Operating Supply Voltage (V) | 2.5 |
| Description |
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