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Specification
| Product Attribute | Attribute Value |
| PPAP | Unknown |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Bank Size | 8/24Mb |
| Cell Type | NOR |
| ECCN (US) | 3A991.B.1.A |
| Packaging | Tape and Reel |
| Pin Count | 80 |
| Automotive | Yes |
| Boot Block | Yes |
| Lead Shape | Ball |
| ECC Support | No |
| PCB changed | 80 |
| Part Status | Obsolete |
| Sector Size | 64Kbyte x 62|8Kbyte x 16 |
| Timing Type | Synchronous|Asynchronous |
| Architecture | Sectored |
| Package Width | 11 |
| Interface Type | Serial|Parallel |
| Package Height | 0.6(Min) |
| Package Length | 13 |
| Number of Banks | 2 |
| Number of Words | 1M |
| Programmability | Yes |
| Supplier Package | Fortified BGA |
| Block Organization | Asymmetrical |
| Chip Density (bit) | 32M |
| Command Compatible | Yes |
| OE Access Time (ns) | 20 |
| Program Current (mA) | 50 |
| Support of Page Mode | No |
| Max. Access Time (ns) | 54 |
| Standard Package Name | BGA |
| Location of Boot Block | Bottom |
| Maximum Erase Time (s) | 460/Chip |
| Operating Current (mA) | 90 |
| Address Bus Width (bit) | 20 |
| Programming Voltage (V) | 3 to 3.6 |
| Number of Bits/Word (bit) | 32 |
| Supplier Temperature Grade | Extended |
| Maximum Programming Time (ms) | 240000/Chip |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Description |
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Beam Electronics is a one-stop platform for electronic components from overseas sites under the "BEAM TECHNOLOGY COMPANY LIMITED" (supporting online ordering and trading). Beam Electronics is committed to building an efficient overseas intelligent IC components trading platform, the main business scope of overseas regions! With the wisdom of data-driven services, the company aims to improve procurement efficiency for the midstream and downstream enterprises in the IC industry, and is determined to become a reliable one-stop procurement platform for overseas IC supply chain.
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